Ingegnere delle Telecomunicazioni
51 ans • San Giorgio a Cremano
Hello, Given my related experience in packaging area developed in more than 10 years in major IC semiconductor companies, I would be interested to your company. My Qualifications: Master in Electronic Engineering and deep understanding of package design choices on device functionality and relevant assembly cost to ensure low cost approach. Wide experience in package design timeline to be reached within the project plans. Daily usage of Cadence SiP/Allegro Package for substrates layout and years of design know-how build, as well as, AutoCAD to create documentations.