Offers “STMicroelectronics”

Expires soon STMicroelectronics

Packaging R&D process responsible M/F

  • Grenoble (Isère)
  • Design/UX/UI

Job description



General information

Reference

2019-2181  

Job level

50 - Manager/Expert

Position description

Posting title

Packaging R&D process responsible M/F

Regular/Temporary

Regular

Job description

IC packaging brings more and more added value into ST components, and becomes a real key differentiator for our portfolio. Especially flipchip technology is growing fast at ST for digital applications, 3D packaging and power/thermal packages. Flipchip packaging enables to integrate very advanced silicon node like 28nm and below, onto a highly integrated laminate or ceramic substrate thanks to bump interconnections (Solder Bumps / Copper pillar / Micro copper pillars). 

R&D packaging leading edge CPA team in Grenoble is looking for a flipchip process development responsible for this dynamic market.

 

The jobholder has the responsibility of a team developping and optimising the SMT, flipchip and underfill assembly processes (flipchip bonding and its protection by a liquid encapsulant). Another important part of the objective is to understand and master the wafer level bumping operations done at fab level or OSAT to insure the packaging process maturity and stability.

 

The Jobholder has to be motivated by technical challenges and teamwork, and be ready to work in an industrial environment as one of its mission is to transfer the developed process recipe and materials into BE manufacturing plants. Main accountabilities :

 

·  Develop assembly flipchip process  (Mass Reflow, Thermo compression, 3D packaging, underfill.) and associated materials
·  Industrialization of the newly developed recipe into BE manufacturing plants
·  Participate in creation of assembly packaging design rules manual (DRM)

Profile

Experienced in technical team management (6 members)

First experience in process development, reliability, packaging.

Other skills

·  Process engineering / Material science / Physical caracterisations
·  Team work
·  DOE (Design of Experiment),
·  Creativity / Innovation 
·  sense of responsibilities & autonomous
·  technical english

Position localisation

Job location

Europe, France, Grenoble

Candidate criteria

Education level required

5 - Master degree

Experience level required

6-10 years

Languages

·  French (4- Mother tongue)
·  English (2- Business fluent)

Requester

Desired start date

02/09/2019

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